Precision Circuit Technology brings advanced high-performance materials to our ultra high-density circuit fabrication technology. Using high-performance materials like Liquid Crystal Polymer (LCP) and particle-free metallized inks with our patented additive and semi-additive (SAP) processes allows us to create miniaturized circuitry with unmatched performance, reliability and signal integrity.
We selected LCP as the dielectric for our additive and semi-additive (SAP) circuit fabrication processes due to its exceptional properties and ease of processing. LCP, a unique thermoplastic with a highly ordered molecular structure in both solid and liquid phases, offers outstanding electrical, thermal, mechanical, and chemical characteristics. These attributes make LCP ideal for constructing ultra high-density circuits with superior reliability and performance.
Excellent dielectric characteristics make LCP perfect for high-frequency and high-data rate applications (up to 110 GHz at 224 Gb/s) such as next generation 5G/6G antennas and mmWave RF modules.
Dielectric Constant (Dk) = 2.9 at 10GHz
Loss Tangent (Df) = 0.0017 at 10GHz
Renowned for exceptional high-temperature resistance, LCP maintains dimensional stability at elevated temperatures (up to 260°C). Furthermore, LCP exhibits a low linear coefficient of thermal expansion (CTE), ensuring minimal dimensional change during thermal cycling.
LCP can be thermoformed into various shapes, supporting the creation of complex multilayer flexible, rigidflex, and rigid circuits, as well as 3-dimensional circuit structures. Its thermoplastic properties also support construction of foldable .printed circuit boards
One of LCP’s standout features is its near hermetic properties. With excellent resistance to moisture, chemicals and other contaminants, LCP demonstrates exceptional dimensional stability even in high humidity environments – an advantage not achievable with conventional substrate materials such as FR4, polyimide and ABF.
Moisture Absorption = 0.04% by weight at 25°C, 50-hour immersion
We use low resistance particle-free metal inks, in copper (Cu), silver (Ag), gold (Au), palladium (Pd) and platinum (Pt), for our additive 2D & 3D circuit printing processes. Unlike traditional nanoparticle inks, our inks contain no surfactants, polymers or binders, making them eco-friendly.
LCP can be thermoformed into various shapes, supporting the creation of complex multilayer flexible, rigid-flex, and rigid circuits, as well as 3-dimensional circuit structures. Its thermoplastic properties also support construction of foldable printed circuit boards.
✓ Reduced Nozzle Clogging
✓ Finer Resolution for Intricate Patterns
✓ Environmental Sustainability
✓ Higher Metal Purity
✓ Denser Microstructure
✓ Better Electrical Performance
✓ Improved Reliability
✓ Lower Cost / Less Precious Metal Usage