Precision Circuit Technology integrates high-performance high-speed connectors and sockets to provide comprehensive assembly and functional testing solutions at both the chip and system levels. Our advanced connector and socket technologies ensure reliable and efficient electrical connections, supporting the rigorous demands of high-speed data transfer and signal integrity.
Our advanced sockets and connectors provide ultra high-density, high-speed interconnections. When paired with high-speed PCBs, high-speed interconnects provide significant improvements in signal integrity at the system level. Additionally, our sockets are game-changing for functional testing, enabling quick and easy chip testing and replacements.
Our ultra high-density sockets and connectors can accommodate up to 1000 pins within a half- square-inch area, significantly outperforming conventional technology which can only achieve density of 20 to 40 pins in the same area.
Our sockets and connectors ensure an extremely low-loss signal path through the system, from one circuit board to another. Conventional connectors often exhibit high signal losses, which significantly limits the performance capabilities of a high-performance circuit. In contrast, our sockets and connectors maintain optimal system performance by minimizing signal degradation.
Chips must past a series of functional performance and signal integrity tests. Current testing platforms rely on test circuit boards and sockets from various vendors, leading to unreliable test results. PCT offers a complete solution, an advanced chip testing platform that includes a high- speed socket and a high-speed test board, both developed using our proprietary technology. This combination ensures reliability of test results.
At the system level, testing is performed with chips integrated into systems and is often performed on 10,000 or more systems simultaneously. To achieve system performance improvements, designers may want to swap chips, requiring time-consuming desoldering. Our chip socket solutions support seamless chip replacement, eliminating the need for desoldering from the PCB, expediting design iterations and reducing time-to-market.
Our semiconductor package adapter allows any multi-chip or large die substrate to be plugged into a system with a superior high-performance, high-reliability interconnect that is separable. When merged with our high-speed connector technology, die can mount directly to the adapter, eliminating the need for a separate substrate.
