Transforming the Electronics Industry

Miniaturizes Circuits
Our revolutionary UHDI materials and processes, supported by over 50 patents, deliver very precise ultra high-density circuit geometries with lines and spaces as small as 6-microns, fostering innovative compact designs for next- generation electronics.

Precision Tolerances
Conventional processes hold about 10% tolerance on a 52-micron trace, resulting in a 5.2-micron deviation. PCT holds tolerances on circuit geometry to 1-micron allowing us to precisely tune circuit impedance to within 1-ohm of the target value.

Ultra-Thin Multi-Layer Stacks
Traditional high-performance circuit boards based on PTFE or glass-reinforced resins are too thick to make very small via connections between layers. Utilizing liquid crystal polymer (LCP) we build ultra-thin circuit stacks up to 30 layers.

Superior Signal Integrity
We specialize in high-density integrations for mmWave electronics, radar, filters and antenna. Using advanced proprietary PCB fab techniques and materials, we craft ultra high-density flexible, rigid-flex, and rigid circuits for high-RF applications.

Chip Embedding Capabilities
PCT can embed die directly into the PCB stack and connect chips to the circuit without the need for wires or ball-grid arrays. Our revolutionary mounting capabilities support miniaturization, electrical performance and mechanical reliability.

High-Speed Interconnects
Our pluggable sockets and connectors feature up to 1000 pins in the area where current technology supports 20 to 40 pins, enabling high-speed I/O data rates while simplifying functional testing and chip replacement.

Quick-Turn 3D Printed Circuits
Current 3D circuit printing technology relies on particle-based conductive inks that require UV curing, which degrades signal integrity. PCT’s particle-free metal inks eliminate the need for curing, resulting in 3D printed circuits with excellent signal integrity.